【Lansheng Technology Information】As a leading supplier of low-power programmable devices, sustainable development is deeply rooted in Lattice's mission. With a strong and growing portfolio of innovative low-power solutions, Lattice helps customers achieve their sustainability goals and make a difference in people's lives.

An excellent example of the use of Lattice technology to create a more sustainable and connected world is the collaboration between Lattice and Bachmann Electronics, a global automation company for wind and renewable energy, industrial machinery manufacturing and marine industries. supplier. Bachmann uses Lattice FPGAs to improve wind farm efficiency and equipment lifetime.

Specifically, Bachmann used easily customizable Lattice FPGAs for its wind turbine control retrofit solution. The program helps turbine owners and operators increase energy production while reducing service and maintenance costs and extending the useful life of their assets. With Lattice FPGAs, Bachmann provides wind turbines with more durable, flexible and customizable solutions, ultimately helping to reduce the cost of renewable energy and making it more affordable.

Lattice is a pioneer in creating sustainable technologies. The Lattice Avant™ and Lattice Nexus™ FPGA platforms have won the 2023 SEAL Sustainability Innovation Award and the 2023 Environment + Energy Leadership Award respectively. They both adhere to the principle of low power consumption design concept.

The Lattice Avant FPGA platform provides leading low power consumption, advanced interconnect and optimized computing power for a variety of mid-range FPGA applications. The Lattice Avant was born out of customer feedback and their need for a powerful mid-range FPGA solution that combines the right features, power and size to help them achieve their design goals. Compared to competing devices, the Lattice Avant delivers 2.5X higher energy efficiency, 2X higher throughput, and 6X smaller package size. Additionally, it is estimated that the energy savings of using Lattice Avant FPGAs over a decade could power 38,000 homes (calculated at 30 kWh/day) compared to comparable devices.

Lattice FPGA solutions power some of the most important technology applications of the next decade and beyond, including artificial intelligence and machine learning, 5G telecom infrastructure, smart vehicles, industrial automation, robotics and security. We are committed to working with customers like Bachmann to help them reduce power consumption and design efficiently, achieving sustainability goals without compromising their design and innovation goals.

【Lansheng Technology Information】On May 24, STMicroelectronics' STL120N10F8 N-channel 100V power MOSFET has extremely low gate-drain charge (QGD) and on-resistance RDS(on), and the figure of merit (FoM) 40% higher than the previous generation of similar products.

The new MOSFET from STMicroelectronics utilizes ST's STPOWER STripFET F8 advanced technology and introduces an oxide-filled trench process, which combines extremely low conduction loss and low gate charge to achieve high-efficiency switching performance. As a result, the STL120N10F8 has a maximum on-resistance RDS(on) of 4.xn--6m-fcc (at VGS = 10V) and operates efficiently up to 600kHz.

STripFET F8 technology also ensures that the output capacitance value can mitigate the drain-source voltage spike, minimizing charge and discharge energy waste. In addition, the body-drain diode of this MOSFET has a higher softness characteristic. These improvements reduce electromagnetic emissions, simplify compliance testing of the final system, and ensure electromagnetic compatibility (EMC) compliance with applicable product standards.

The STL120N10F8 has excellent energy efficiency and low electromagnetic radiation, which can enhance the power conversion performance of hard-switching and soft-switching topologies. In addition, it is the first STPOWER 100V STripFET F8 MOSFET to fully meet industrial specifications, making it ideal for motor control, power supplies and converters for telecom and computer systems, LED and low-voltage lighting, as well as consumer appliances and battery-operated equipment.

STMicroelectronics' new MOSFETs also have other advantages, including a small difference in gate threshold voltage (VGS(th)), which is useful in high-current applications and simplifies the parallel design of multiple power switches. The robustness of the new product is very strong, able to withstand 800A short-circuit pulse current impact for 10µs.

【Lansheng Technology Information】On May 11, Diodes Incorporated announced the launch of new products in its synchronous buck converter portfolio. The continuous output current ratings of the AP62500 and AP62800 are 5A and 8A, respectively, giving engineers more flexibility when developing point-of-load (POL) solutions optimized for efficiency or size.

Both of Diodes' buck converters feature a wide input voltage range: the AP62500 covers 4.5V to 18V and the AP62800 covers 4.5V to 17V (both for 5V and 12V rail product applications), and both output voltages are adjustable down to 0.6V. A choice of three different switching frequencies (400kHz, 800kHz and 1.2MHz) allows engineers to prioritize conversion efficiency or focus on small form factors. Additionally, these devices have three modes of operation to choose from; Pulse Frequency Modulation (PFM) to improve light load efficiency, Pulse Width Modulation (PWM) to reduce output voltage ripple, Ultrasonic (USM) to avoid audible frequency range , while ensuring that the switching frequency remains above 20kHz.

This product from Diodes contributes to the improvement due to the relatively low on-resistance (RDS(ON)) values of the high-side MOSFETs (47mΩ for AP62500; 22mΩ for AP62800) and low-side MOSFETs (18mΩ for AP62500; 10mΩ for AP62800). Buck conversion efficiency. Ultralow quiescent current (IQ) is also achieved in PFM mode (195µA typical), further improving light load efficiency.

These buck converters are designed to significantly reduce electromagnetic interference (EMI) concerns. A special casket driver design reduces switching node ringing without extending MOSFET turn-on/turn-off times, which would affect high-frequency switching functions. Constant on-time (COT) control achieves fast transient response and low output voltage ripple, and helps make the loop more stable. Another important feature is an adjustable soft-start time to prevent the risk of damage from inrush currents.

【Lansheng Technology Information】On May 10, 2023, ON Semiconductor launched the latest generation of 1200 V EliteSiC silicon carbide (SiC) M3S devices, helping power electronics engineers achieve better energy efficiency and lower system costs. New product family includes EliteSiC MOSFETs and modules that help improve switching speeds to accommodate the growing number of 800 V electric vehicle (EV) on-board chargers (OBC) and EV DC fast charging, solar solutions, energy storage and more Energy infrastructure applications.

The portfolio also includes new EliteSiC M3S devices featuring half-bridge Power Integrated Modules (PIMs) with industry-leading ultra-low Rds(on) in standard F2 packages. These modules are ideal for DC-AC, AC-DC and DC-DC high power conversion stages in industrial applications. They offer higher levels of integration with an optimized direct-bond copper design for balanced current sharing and thermal distribution between paralleled switches. These PIMs are designed to provide high power density and are suitable for energy infrastructure, DC fast charging of electric vehicles and uninterruptible power supplies (UPS).

"ON Semiconductor's latest generation of automotive and industrial EliteSiC M3S products will help designers reduce their application footprint and lower system thermal requirements," said Asif Jakwani, senior vice president and general manager of the Advanced Power Division at ON Semiconductor. This helps designers develop High-power converters with higher energy efficiency and higher power density."

Automotive-grade 1200 V EliteSiC MOSFETs are designed for high-power OBCs up to 22 kW and high-voltage to low-voltage DC-DC converters. M3S technology is specially developed for high-speed switching applications and has a switching loss figure of merit that leads similar products.

【Lansheng Technology Information】On April 11, 2023, STMicroelectronics announced that two USB Power Delivery (USB PD) Extended Power Range (EPR) chips have obtained USB-IF certification. These two chips are used for power supply/charging The adapter end (power supply) and device end (receiver) of the charger extend the output power range of the universal charger to 140W. Now, only one AC-DC adapter can charge most of the electric devices, such as computers, Smart home actuators, power tools, e-bikes, and traditional charging products such as mobile phones, tablets, smart watches.

Matteo Lo Presti, executive vice president of Analog, MEMS and Sensors Division, Analog Products Division, STMicroelectronics, said: "ST is a pioneer in the semiconductor industry and is now able to provide USB-IF certified reference designs and chips to meet customer requirements for high power, industry The need for a standard universal charger/adapter. By responding quickly, supporting USB Power Delivery EPR, and obtaining product certification, we are accelerating the USB-C® connector replacement of custom power plugs and DC adapters in many applications, using universal AC or DC Adapter charging, reducing cost and environmental impact."

Certified by USB-IF, the output power is up to 140W (28V@5A). REF_STUSB140W (powered chip) and ST-ONEHP (power chip) are the two halves of the overall USB PD reference design. The powered reference design ensures that designers have a cost-effective prototyping solution that is energy-efficient and seamlessly integrates USB PD. The ST-ONEHP chip is pre-installed with certified USB PD 3.1 EPR firmware.

In conclusion, the new USB solution helps to promote the wider adoption of the USB-C connector, charging with a common AC-DC adapter, which will reduce the number of adapters and e-waste carried by end users, while also reducing transportation costs and CO2 emissions.

【Lansheng Technology Information】On April 6, 2023, Diodes announced the launch of a new bidirectional transient voltage suppressor diode (TVS) to meet the market's demand for robust protection of high-speed data ports. The D3V3Z1BD2CSP is designed to meet protection against electrostatic discharge (ESD) shock and surge events. Primary applications for this product are high-performance computing hardware, I/O ports for smartphones, laptops and tablets, monitors, and game consoles.

While many competing products have to make a design compromise between strong surge protection features or low input capacitance, the D3V3Z1BD2CSP can provide both. Its extremely low capacitance value (0.3pF typical) does not interfere or prevent high-speed data communications, thus ensuring that signal integrity is maintained. Its high peak pulse current (10.5A typical) and low clamping voltage (5.3V) protect I/O ports and their sensitive electronic components from transient voltages. The risk of electrical overload damage caused by activities such as frequent hot swapping is thus avoided. The D3V3Z1BD2CSP complies with the IEC61000-4-2 immunity standard and provides robust ESD protection against ±20kV air and contact discharge, thereby increasing system reliability.

The D3V3Z1BD2CSP can be used to protect I/O interfaces such as USB Type-C®, DisplayPort™, HDMI™, and SD cards, carrying high-speed data transfer rates up to 20Gbps. The -55°C to +150°C operating temperature range ensures continuous protection in challenging product application environments.

Diodes' D3V3Z1BD2CSP TVS is packaged in an extremely compact DSN0603 wafer-level chip size package measuring only 0.6mm x 0.3mm x 0.3mm.

【Lansheng Technology Information】Recently, the international technology giant Samsung Electronics announced that it will no longer use the Android operating system, but will launch a new operating system to compete with Huawei's Hongmeng system. The news has sparked widespread concern and speculation in the global tech community.

As one of the most mainstream mobile operating systems in the world, the Android operating system has provided strong support for Samsung mobile phones for a long time. However, with the rise and continuous development of Huawei's Hongmeng system, Samsung decided to meet new challenges and launch its own brand new operating system.

Samsung's move to abandon Android and launch a new operating system is considered to be a strong response to Huawei's Hongmeng system. With its highly autonomous and controllable features and cross-device interconnection, Huawei Hongmeng system has gradually emerged in the domestic and foreign markets. Samsung's move is intended to enhance product competitiveness and maintain a leading position in the global market through independent research and development of the operating system.

It is reported that Samsung's new operating system will focus on user experience and security, and have higher intelligence and adaptive capabilities. The operating system will support a variety of device types, including smartphones, tablets, smart wearable devices, etc., to provide users with a more convenient and smooth operating experience.

Lansheng Technology Limited, which is a spot stock distributor of many well-known brands, we have price advantage of the first-hand spot channel, and have technical supports.
Our main brands: STMicroelectronics, Toshiba, Microchip, Vishay, Marvell, ON Semiconductor, AOS, DIODES, Murata, Samsung, Hyundai/Hynix, Xilinx, Micron, Infinone, Texas Instruments, ADI, Maxim Integrated, NXP, etc
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【Lansheng Technology Information】Recently, chip design tool manufacturer Synopsys announced that it has signed a new agreement with Intel, and its technology building blocks will be included in Intel's advanced contract manufacturing business.

Synopsys will enable its portfolio of standardized interface IP on Intel's leading processing technology. As a result, Intel's foundry customers will gain access to industry-leading IP built on Intel's advanced process technology and be able to accelerate SoC design execution and project schedules.

The multigenerational IP deal builds on the two companies' decades-long collaboration, which includes combining Synopsys' AI-powered EDA suite with Intel's technology and design expertise to develop advanced design flows. Synopsys will leverage its state-of-the-art design technology tools and implementation and signoff flows to deliver enhanced power, performance and area for SoC and system-on-a-chip designs based on Intel 3 and Intel 18A process technologies.

IFS is a key pillar of Intel's IDM 2.0 strategy, a multi-year transformation aimed at regaining and strengthening technology leadership, manufacturing scale and long-term growth. Intel's collaboration with Synopsys is an important milestone in achieving this goal and builds on Intel's existing collaborations with other IP and EDA providers.

"This transaction marks another important step in our IDM 2.0 strategy, which will allow designers to take full advantage of Intel 3 and Intel 18A process technologies and quickly bring differentiated products to market, thereby fostering a vibrant foundry ecosystem.” said Stuart Pann, Intel Senior Vice President, President and General Manager of the IFS Business, “Synopsys has a proven track record of delivering high-quality IP to a broad customer base, and this agreement will IP on advanced IFS nodes."

"Intel and Synopsys have developed a long-term strategic partnership in the development of EDA and IP solutions, enabling Intel to address the complex requirements of data-intensive applications," said Joachim Kunkel, general manager of the Solutions Group at Synopsys. Intel's collaboration on key IP development and design and system technology optimization enables our mutual customers to accelerate their next-generation high-performance, AI-enabled designs today and into the future."

【Lansheng Technology Information】Toshiba announced today that it has launched two automotive 40V N-channel power MOSFETs using Toshiba's new S-TOGLTM package and U-MOS IX-H process chip - "XPJR6604PB" and "XPJ1R004PB".

High safety-level applications such as autonomous driving systems can ensure reliability through redundant designs, so they integrate more components and require more surface-mount space than standard systems. Therefore, to further reduce the size of automotive equipment, power MOSFETs that can be surface-mounted at high current densities are required.

The XPJR6604PB and XPJ1R004PB adopt Toshiba's new S-TOGLTM package (7.0mm×8.44mm[1]), which is characterized by a post-free structure that integrates the source connector and external pins. The multi-pin structure of the source pins reduces package resistance.

Compared with Toshiba TO-220SM (W) package products [2] with the same thermal resistance characteristics, the combination of S-TOGLTM package and Toshiba U-MOS IX-H process can achieve a significant reduction of 11% in on-resistance. The new package also reduces the required surface mount area by approximately 55 percent compared to the TO-220SM(W) package. In addition, products in the new package offer a drain current rating of 200A, which is higher than that of Toshiba's similarly sized DPAK+ package (6.5mm x 9.5mm[1]), enabling high current. Overall, the S-TOGL™ package enables high density and compact layout, reduces the size of automotive equipment, and contributes to high heat dissipation.

Since automotive equipment may operate in extreme temperature environments, the reliability of surface mount solder joints is a key consideration. The S-TOGLTM package adopts gull-wing pins, which can reduce surface mount stress and improve the reliability of solder joints.

Toshiba will continue to expand its lineup of power semiconductors and contribute to the realization of carbon neutrality through user-friendly, high-performance power devices.

【Lansheng Technology Information】Recently, Bosch, Infineon, Nordic Semiconductor, NXP, and Qualcomm have jointly invested in a company that provides compatible products that support RISC-V, reference architectures, and helps establish solutions that are widely used in the industry. The new company's initial application focus will be automotive, but will eventually expand to mobile and the Internet of Things.

On the other hand, according to data from chip research firm Semico Research Corp, shipments of RISC-V cores will reach 80 billion by 2025, accounting for 14% of CPU cores by 2025. Semico predicts that from 2020 to 2027, the overall annual growth rate of SoC shipments with RISC-V cores will be 74%, and the automotive field will increase by 70% per year. Counterpoint Research says RISC-V will penetrate 10% of the automotive market by 2025.

Through these news and data, we can see that the new technology RISC-V will profoundly affect the automotive electronics industry. RISC-V research and development started in 2015, mostly at the academic and start-up level, but is now rapidly maturing. RISC-V is considered an open technology, just like Linux. The infrastructure can be licensed for free and can then be modified by any company to suit their needs. It can replace the widely used x86 architecture, and the ARM architecture that are currently used. Therefore, RISC-V has the potential to penetrate the ARM-dominated automotive industry and accelerate the development of automotive electronics.

Lansheng Technology Limited, which is a spot stock distributor of many well-known brands, we have price advantage of the first-hand spot channel, and have technical supports.
Our main brands: STMicroelectronics, Toshiba, Microchip, Vishay, Marvell, ON Semiconductor, AOS, DIODES, Murata, Samsung, Hyundai/Hynix, Xilinx, Micron, Infinone, Texas Instruments, ADI, Maxim Integrated, NXP, etc
To learn more about our products, services, and capabilities, please visit our website at http://www.lanshengic.com