【Lansheng Technology Information】On August 31, 2023, STMicroelectronics announced that the ST87M01 NB-IoT and GNSS module has obtained Vodafone NB-IoT certification. The ST87M01 integrates mobile IoT access and geolocation functions in a small, low-power, integrated module, suitable for various IoT and smart industrial applications.

STMicroelectronics' ST87M01 was also recently certified by the Global Certification Forum (GCF), an organization that promotes interoperability of mobile network and IoT products. The module complies with 3GPP Release 15 technical specifications and provides greater multi-region LTE coverage.

The NB-IoT certification of the ST87M01 is also timely for new electricity, water and gas smart metering systems planned for global rollout. In India in particular, the module represents a very effective smart meter deployment scenario, which is expected to reach 250 million smart meter deployments in the next five years.

The module integrates the advanced embedded SIM card ST4SIM embedded SIM (eSIM), and has passed the latest industry standard certification, for example, GSMA eSA (Security Assurance) certification. Inside ST4SIM there is also a certified Embedded Security Element (eSE). The entire circuit is housed in a tiny 10.6mm x 12.8mm LGA package.

Low-power features maximize battery life in battery-powered applications, and the on-chip integrated native GNSS satellite receiver operates during NB-IoT sleep periods for improved power-saving features.

Developers can easily integrate the ST87M01 with other ST products, such as MEMS smart actuators and sensors, interfaces and other connectivity chips, to develop more IoT applications that require geolocation accuracy. These include pet and personal item tracking devices, industrial asset tracking, and sensors used throughout smart infrastructure, smart farming, and more.

【Lansheng Technology Information】August 31, 2023 — Vishay Technology announced the launch of three new series of miniature infrared sensor modules for remote control systems - dual-lens TSMP95000 and single-lens TSMP96000 and TSMP98000. The Vishay Semiconductors dual-lens TSMP95000 and single-lens TSMP96000 and TSMP98000 feature modulated carrier output for code learning applications, supply voltages from 2.0 V to 5.5 V, and consume as little as 0.35 mA typical at 3.3 V.

The devices released today feature new ICs designed in-house to ensure long-term availability and shorten lead times, replacing previous-generation solutions in a pin-compatible manner while improving performance. In addition to a wide supply voltage range and 50% lower power consumption, the TSMP95000, TSMP96000 and TSMP98000 have a bandwidth of only 30 kHz to 60 kHz, excellent noise immunity, ESD resistance up to 12 kV (human body model), and improved DC strong direct sunlight performance.

The devices released today feature new ICs designed in-house to ensure long-term availability and shorten lead times, replacing previous-generation solutions in a pin-compatible manner while improving performance. In addition to a wide supply voltage range and 50% lower power consumption, the TSMP95000, TSMP96000 and TSMP98000 have a bandwidth of only 30 kHz to 60 kHz, excellent noise immunity, ESD resistance up to 12 kV (human body model), and improved DC strong direct sunlight performance.

The device is compatible with TTL and CMOS. When equipped with a single TSAL6200 transmitter, the typical light intensity is 12 mW/m2 and the transmission distance is 1.8 m. The sensor module is RoHS and Vishay green compliant and halogen free.

【Lansheng Technology Information】Toshiba Electronics announced on August 29 that it launched the industry's first [1] 2200V dual silicon carbide MOSFET module --- "MG250YD2YMS3". The new module uses Toshiba's third-generation SiC MOSFET chip, and its drain current (DC) rating is 250A, which is suitable for applications using DC 1500V such as photovoltaic power generation systems and energy storage systems. The product supports volume shipments starting today.

Industrial applications like the above usually use DC 1000V or lower power, and most of its power devices are 1200V or 1700V products. However, DC 1500V is expected to be widely used in the next few years, so Toshiba released the industry's first 2200V product.

MG250YD2YMS3 has low conduction loss and low drain-source turn-on voltage (sensor) of 0.7V (typ.) [2]. In addition, it has low turn-on and turn-off losses of 14mJ (typ.) [3] and 11mJ (typ.) [3], respectively, about 90% lower than typical silicon (Si) IGBTs[ 4]. These features all help to improve equipment efficiency. Since MG250YD2YMS3 can achieve lower switching loss, users can replace traditional three-level circuits with two-level circuits with fewer modules, which contributes to the miniaturization of equipment.

Lansheng Technology Limited, which is a spot stock distributor of many well-known brands, we have price advantage of the first-hand spot channel, and have technical supports.
Our main brands: STMicroelectronics, Toshiba, Microchip, Vishay, Marvell, ON Semiconductor, AOS, DIODES, Murata, Samsung, Hyundai/Hynix, Xilinx, Micron, Infinone, Texas Instruments, ADI, Maxim Integrated, NXP, etc
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【Lansheng Technology Information】On April 26, 2023, STMicroelectronics released a new extension tool that brings the advantages of Microsoft's integrated development environment Microsoft® Visual Studio Code (VS Code) to STM32 microcontrollers.

VS Code is a popular integrated development environment (IDE) known for its ease of use and flexibility. For example, IntelliSense simplifies and speeds up code editing. Now developers can enter the STM32 ecosystem from VS Code, allowing more embedded developers in the STM32 community to use these features, and allowing developers who are accustomed to developing advanced and consumer applications to easily create energy-saving, compact, and economical Embedded solutions.

Daniel Colonna, Director of Microcontroller Marketing at STMicroelectronics, said: "Integrating VS Code into the STM32 ecosystem allows more developers to enjoy the advantages of industry-leading STM32 microcontroller products. Development of VS Code as the preferred development environment Developers, including advanced software developers, academics, hobbyists and makers, can now choose to implement their ideas with STM32 MCUs without leaving their preferred development environment."

Marc Goodner, principal product manager at Microsoft, said: "Through our deep cooperation with STMicroelectronics, we provide developers with the ability to use STM32 projects in Visual Studio Code, providing an excellent solution for existing STM32 embedded developers. solutions while extending the reach of the STM32 platform to the millions of developers already using Visual Studio Code."

The new support tools expand tool choices for all STM32 developers, including hardware integrators and mass-market customers, who typically choose either commercial tools or STMicroelectronics' free Eclipse-based STM32CubeIDE development environment. Both VS Code and STM32 VS Code Extension are free to use.

【Lansheng Technology Information】On September 1, 2023, Samsung announced that it has developed its largest-capacity 32Gb DDR5 DRAM (DDR5 DRAM: fifth-generation double data rate synchronous dynamic random access memory) using 12-nanometer (nm) process technology. This is another achievement following Samsung's mass production of 12nm-class 16Gb DDR5 DRAM in May 2023, which solidifies Samsung's position in the field of developing next-generation DRAM memory technology and opens a new chapter in the era of large-capacity memory .

"Based on Samsung's latest 12nm-class 32Gb memory, we can develop a solution to achieve 1TB memory modules, which will help meet the growing demand for large-capacity DRAM memory in the era of artificial intelligence and big data." SangJoon Hwang, executive vice president of the memory development group of Samsung Electronics Memory Division, said, "We will continue to develop memory solutions through differentiated process and design technologies to break through the bottleneck of memory technology."

Since Samsung developed the first 64 kilobit (Kb) memory in 1983, it has increased memory capacity by a factor of 500,000 over the past 40 years. The newly developed 32Gb DDR5 memory particle adopts the cutting-edge process technology, which improves the integration density and optimizes the package design. Compared with the DDR5 16Gb chip, under the same package size, the capacity of Samsung's single-chip DRAM memory particle doubles.

In particular, DDR5 128GB memory modules manufactured using 16Gb memory particles in the past required a through-silicon via (TSV) process. Now, by using the newly developed 32Gb memory particles, it is possible to produce 128GB memory modules without using the through-silicon via (TSV) process. Compared with a 128GB memory module using a 16Gb memory package, its power consumption is reduced by about 10%. This technological breakthrough makes the product the solution of choice for enterprises concerned with energy efficiency, such as data centers.

Based on 12nm-class 32Gb DDR5 DRAM, Samsung plans to continue expanding its lineup of high-capacity memory products to meet the growing demands of the high-performance computing and IT industries. By offering 12nm-class 32Gb memory to data centers and customers adopting applications such as artificial intelligence and next-generation computing, Samsung hopes to strengthen its position at the forefront of the next-generation memory market. In the future, this product will also play a vital role in Samsung's long-term cooperation with other core industry partners.

【Lansheng Technology Information】May 31, 2023 — Vishay Intertechnology announced that it has launched a new thick film power resistor ISOA that has passed AEC-Q200 certification, adopts a small SOT-227 package, and can be directly mounted on a heat sink. . Vishay MCB has high pulse handling capability, power dissipation up to 120 W at 85 C bottom case temperature, optional NTC thermistor for internal temperature monitoring, pre-coated phase change thermal interface material (PC-TIM) to improve the paste Install efficiency.

The recently released device uses an aluminum substrate instead of a metal sheet, which can be used as a pre-charge, discharge, active discharge or snubber resistor, reducing costs for automotive, industrial, avionics, defense and space (AMS) applications. ISOA can choose to integrate AEC-Q200 certified and temperature cycle tested NTC thermistors in the resistor package, which simplifies design and saves board space. At the same time, optional PC-TIM improves the efficiency of production, processing and placement.

Vishay's recently released device uses an aluminum substrate instead of a metal sheet, which can be used as a pre-charge, discharge, active discharge or snubber resistor, reducing the cost of automotive, industrial, avionics, defense and space (AMS) applications. ISOA can choose to integrate AEC-Q200 certified and temperature cycle tested NTC thermistors in the resistor package, which simplifies design and saves board space. At the same time, optional PC-TIM improves the efficiency of production, processing and placement.

The device's high power and high energy dissipation simplifies design and reduces cost by requiring fewer power devices. The resistance has high-energy pulse handling capability (up to 110 J/0.1 s), and has passed 3000 times of 230 J/670 ms and 5000 times of 350 J/1060 ms multi-pulse cycle test, suitable for various kinds of high-energy and repetitive surge pulses application. In addition, the device provides customer-defined tests.

ISOA resistance ranges from 0.47 Ω to 1 MΩ with tolerances of 5 % and 10 %, and TCRs of ± 100 ppm/K, 150 ppm/K, and ± 300 ppm/K, respectively. The maximum working voltage of the resistor is 1500 V, the working temperature range is -55 C to +150 C, and the dielectric strength is 4000 Vrms. The device is RoHS compliant and features an inductorless design that can include two different resistors.

【Lansheng Technology Information】ROHM, a world-renowned semiconductor manufacturer, has launched two new high-speed thermal printheads "TE2004-QP1W00A (203dpi)" and "TE3004-TP1W00A (300dpi)", which are very suitable for logistics and inventory Barcode label printers used to print labels in areas such as management.

In recent years, the e-commerce (EC) market has been booming, and consumers' needs have become more and more diverse, which has led to an increasing demand for logistics labels and inventory management labels. However, with the previous thermal print head technology, 250mm/sec to 300mm/sec is already the limit of printing speed. Against this backdrop, ROHM has developed highly reliable high-speed thermal printheads using new structures and technologies, achieving print speeds, print quality, and durability that surpassed previous limits.

Compared with the previous products, the new products have been greatly improved in terms of circuit board materials, structures, and wiring patterns. Especially the heating part that affects the printing speed and printing quality, the structure uses ROHM's own 3D processing technology, which realizes the industry's ultra-fast printing speed of 500mm/s (about twice that of previous products).

In addition, by applying a double-layer high-hardness protective film on the print head, the wear resistance and antistatic properties during high-speed printing are improved, and the corrosion resistance to moisture and salt is also improved, allowing the print head to last longer.

ROHM continues to contribute to improving label printing efficiency in various industries by applying newly developed technologies to new products.

Lansheng Technology Limited, which is a spot stock distributor of many well-known brands, we have price advantage of the first-hand spot channel, and have technical supports.
Our main brands: STMicroelectronics, Toshiba, Microchip, Vishay, Marvell, ON Semiconductor, AOS, DIODES, Murata, Samsung, Hyundai/Hynix, Xilinx, Micron, Infinone, Texas Instruments, ADI, Maxim Integrated, NXP, etc
To learn more about our products, services, and capabilities, please visit our website at http://www.lanshengic.com

【Lansheng Technology Information】April 25, 2023, STLINK-V3PWR is a new in-circuit debug programmer from STMicroelectronics, which can accurately measure the application running on any STM32 microcontroller (MCU) power consumption.

The product's wide dynamic range can handle power-sensitive developments such as IoT and wireless applications, and can measure current values from nanoamps to 500mA with a measurement accuracy of ±0.5%. In addition, the product can provide up to 2A of current to the target system with a single USB cable, and developers do not need to connect a separate power supply to power the board.

STMicroelectronics' STM32CubeMonitor-Power graphics tool directly supports STLINK-V3PWR, which can display the power demand of the application in real time and analyze the impact of design changes on power consumption in order to improve energy efficiency. Additionally, the product is supported by Arm® Keil® development tools and the IAR integrated development environment (IDE), enabling simultaneous code execution and energy measurement to optimize the application energy map.

The STLINK-V3PWR further enhances STMicroelectronics' power-conscious embedded development kit offering. The STM32 Power shield (X-NUCLEO-LPM01A), is a programmable power supply with a dynamic current measurement range of 100nA to 50mA, typically used to analyze the power consumption of applications running on ultra-low-power STM32 MCUs. Additionally, the meter on the mid-board of the STM32L562E-DK Discovery Kit can measure dynamic currents from 300nA to 150mA. STM32CubeMonitor-Power obtains power measurement values through any of these three tools, presents data in real time, and updates the collected power parameters.

As a debug programmer for microcontrollers, STLINK-V3PWR communicates with the STM32 MCU on the application board through a single-wire debug (JTAG/SWD) interface, as well as a virtual COM port interface and a multipath The /UART/I2C/CAN/GPIO interface communicates with the target microcontroller to facilitate firmware updates and on-site power measurement tests.

【Lansheng Technology Information】June 1, 2023 - NXP Semiconductors officially released the i.MX 91 application processor series. Building on NXP's more than two decades of leadership in developing multi-market application processors, the i.MX 91 family offers an optimized combination of security, features, and power efficiency for next-generation Linux®-based IoT and industrial application needs.

Newly released protocols change the direction of new product categories in the IoT and industrial markets, such as Matter, the interoperable secure connectivity standard for the smart home of the future, or the ISO 15118-20 standard for electric vehicle chargers. Such new products are usually based on Linux, because Linux can provide developers with the scalability and programming convenience they need to promote application development and extend product life. NXP's i.MX 91 family enables developers to quickly create new Linux-based edge devices such as home controllers, connected appliances, home entertainment, industrial scanning and printing, building controls, electric vehicle chargers and medical platforms.

"The i.MX 91 family reinforces NXP's leadership in intelligent controllers," said Jim McGregor, principal analyst at TIRIAS Research. "Next-generation Linux devices based on i.MX 91 applications processors will be high-performance, cost-effective security solutions that enable faster, more timely, and easier deployment of new versions of protocols or standards. It provides an important platform for engineers to add intelligent functionality to traditional embedded and IoT systems while leveraging a wider range of i The .MX 9 Series provides scalability."

As the entry-level product of the i.MX 9 series, the i.MX 91 series has the scalability and programming convenience required by developers, making it easy to continuously update applications in the future. The i.MX 91 series can share hardware and software with NXP's i.MX 93 series, providing additional platform options for expanding product lines, maximizing reuse of investment in development and shortening time to market.

【Lansheng Technology Information】Recently, at the 2023 SID Display Week event held in the United States, Samsung demonstrated a brand new screen panel called Sensor OLED, which is the world's first OLED panel with built-in fingerprint sensor and heart rate sensor.

There is no significant difference in display performance between the Sensor OLED panel and the traditional OLED panel, but the Sensor OLED panel has a built-in light-sensing OPD (organic photodiode), which makes it no longer necessary to separate the screen under the screen during the production process of mobile phones and other products. Installing the fingerprint sensor not only reduces the space occupation, but also reduces the cost. Samsung says the technology can significantly reduce the complexity of a phone or tablet by integrating biometric and health-tracking sensors.

According to Samsung Display, this light-sensing technology is built into each pixel of the new OLED panel, so it can simultaneously sense fingerprints or heart rate information from multiple fingers. This will allow devices to provide more accurate biometric authentication and measure blood pressure.

It is reported that the display using Sensor OLED can measure the user's heart rate, blood pressure and stress level, just by touching two fingers. Depending on the constriction and relaxation of the blood vessels in the finger, the OLED light is reflected in different ways, and when it returns to the panel, the OPD recognizes it and converts it into health information. A Samsung Display representative said: "The Sensor OLED display can simultaneously sense the fingers of both hands, providing more accurate health information than existing wearable devices."

The emergence of this Sensor OLED panel not only provides users with more convenient and safer biometric identification functions, but also greatly reduces the manufacturing cost and process complexity of manufacturers' products, and can also make future mobile phones or tablets, etc. Products become thinner and lighter. It is understood that Samsung said that in the future, the Sensor OLED panel will be preferentially applied to the Galaxy series of mobile phones and tablets.