【Lansheng Technology Information】 Recently, Samsung Electronics announced that its latest automotive processor Exynos Auto V920 has been designated for Hyundai's next-generation In-Vehicle Infotainment project, and is expected to be officially put into use in 2025. This is a milestone cooperation between Samsung and Hyundai Motor, a world-renowned automobile brand, in the field of automotive semiconductors.

Samsung Exynos Auto V920 processor
Exynos Auto V920 is Samsung's third-generation automotive processor for in-vehicle infotainment systems. The V920 has been greatly upgraded in terms of CPU, graphics and AI performance. The V920 processor has built-in 10 latest Arm cores optimized for autonomous driving, and its processing performance is 1.7 times higher than that of the second-generation platform. With the excellent speed of LPDDR5 memory, V920 can support up to 6 high-resolution screens with multi-screen display, and up to 12 camera sensors concurrently. The V920 integrates an advanced GPU core, and the graphics processing speed is twice that of the second-generation platform. By applying the latest computing core, the performance of the intelligent neural processing unit (NPU) reaches 2.7 times that of the previous generation platform, therefore, the V920 supports more advanced driver monitoring functions. The V920 also ensures the robustness of the IVI system through built-in safety islands.

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Vitesco Technologies and ON Semiconductor recently announced a $1.9 billion 10-year supply agreement for silicon carbide products to enable Vitesco Technologies to advance in electrification technology. Vitesco Technologies, an international leading manufacturer of modern drive technology and electrification solutions, will provide ON Semiconductor with an investment of US$ 250 million to purchase new equipment for silicon carbide ingot growth, wafer production and epitaxy, so as to lock in carbonization in advance Silicon production capacity. These facilities will be used to produce SiC wafers to support Vitesco Technologies' growing SiC business needs. At the same time, as a leader in smart power and smart sensing technology, ON Semiconductor will continue to invest heavily in the end-to-end silicon carbide supply chain.

Hassane El-Khoury, President and CEO of ON Semiconductor, said: "This cooperation will help Vitesco Technology meet its customers' needs for longer range and higher performance in electric vehicles. ON Semiconductor provides excellent product performance and quality and supply Guaranteed, mass-manufactured SiC technology based on decades of experience in manufacturing power semiconductor products for numerous automotive applications."

Silicon carbide semiconductors are a key technology for electrification, enabling energy-efficient power electronics that shorten charging times and extend the range of electric vehicles. Especially at high voltage levels such as 800V, silicon carbide inverters can achieve higher energy efficiency than silicon devices. Since 800V is a prerequisite for fast and convenient high-voltage charging, silicon carbide devices are increasingly emerging worldwide.

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Micron Technology is preparing to receive about 200 billion yen in financial incentives from the Japanese government to help it produce next-generation memory chips in the country, according to information received by Lansheng Technology, the latest in Tokyo's efforts to boost domestic semiconductor production.

Micron will use the funds to install ASML Holding NV's advanced EUV chip-making equipment at its factory in Hiroshima to make DRAM chips. The funding is likely to be announced when Japanese Prime Minister Fumio Kishida meets a delegation of chip executives including Micron Chief Executive Officer Sanjay Mehrotra on Thursday.

Micron has invested more than $13 billion in Japan since 2013, including a push last year to produce so-called one-beta DRAM chips. The latest funding will help Micron produce what it calls one-gamma production, a more advanced technology Micron plans to launch by the end of 2024. Suppliers that will benefit from Micron's investment include Tokyo Electron Ltd. and ASML in the Netherlands.

Micron reported a loss of more than $2 billion in its latest quarter as it sold memory below its production cost due to an industry oversupply of memory chips this year. Micron management responded with what they called a historic quickness to cut pay, layoffs and production, and called on peers to follow suit. The second half of 2023 should prove a bottom for the DRAM market, especially if other companies also cut production, the company said.

The only U.S. company still in the memory chip business at scale is Western Digital, which doesn't make its own products but relies on partner Kioxia to make flash memory at factories in Japan. Micron has used its position as the sole U.S. memory maker to push Washington to subsidize the return of U.S. domestic manufacturing. Its executives have been taking the lead in lobbying the government.

Unlike rivals Samsung and SK Hynix, Micron has not shifted any of its wafer fabrication work to mainland China. Outside of its home country, Micron has factories in Taiwan, Singapore and Japan that are holdovers from past acquisitions.

Recently, STMicroelectronics released a smart sensor processor programming tool chain and supporting software package, which is convenient for developers to write application code for STMicroelectronics' latest generation of smart MEMS IMU sensor modules ISM330IS and LSM6DSO16IS, using the smart sensor processor inside the module (ISPU) handles the computational work associated with motion detection, for example, running activity recognition and anomaly detection algorithms directly on the sensor. Algorithm calculations moved down to the edge of the network help reduce system power consumption, shorten response delays, reduce the workload of the local microcontroller, and set sensor behaviors according to specific practical applications.

When using the ISPU toolchain, developers can write smart sensor software in the familiar and widely used C programming language, choose to write code in the command line interface (CLI) or Eclipse-based development environment (such as STM32CubeIDE), or choose AlgoBuilder , Unicleo and other graphical user interfaces.

The X-CUBE-ISPU software package contains templates and sample projects, as well as ready-made software libraries, which help developers quickly understand how to use ISPU, write ISPU code, and can modify the software package to develop custom algorithms. The package also provides pre-built files that allow the user to load the X-CUBE-ISPU example directly to the sensor using a GUI without writing code. Additionally, there are many more examples, tutorials, and other development resources on STMicroelectronics' GitHub repository.

Using these resources can help reduce development time for applications such as personal electronics, including wearable devices for activity recognition and health monitoring, as well as industrial equipment such as asset tracers, equipment condition monitors, robotics, machine controllers, and more.

STMicroelectronics' ISM330IS and LSM6DSO16IS inertial modules include an always-on 3D accelerometer and 3D gyroscope, as well as an embedded ISPU processor. The power consumption of both modules is very low, the power consumption in low power mode is only 0.46mA, and the noise in high performance mode is 70μg/√Hz. The sensor data fusion function allows the module to collect data from four external sensors. The module also includes an embedded temperature sensor. Both products are housed in a compact land grid array (LGA) plastic package measuring 2.5mm x 3mm x 0.83mm.

SPM Instrument, a condition monitoring and process optimization innovator in Strängnäs, Sweden, developed a vibration level analysis product using the ISM330IS sensor and quickly customized the ISPU using the STMicroelectronics ISPU toolchain and the X-CUBE-ISPU development environment Behavior.

SPM's sensing solutions are ideal for remote monitoring of standard manufacturing equipment such as pumps and fans, as well as machinery and equipment placed in harsh or hazardous environments where access by maintenance personnel is difficult. The ISM330IS enables designers to meet tight power budgets while overcoming the lack of computing power of local microcontrollers.

【Lansheng Technology information】According to news from Intel on June 6, it implemented backside power supply technology on product-level test chips to meet the performance requirements of the next computing era.

According to reports, as Intel's backside power delivery solution, PowerVia will be launched on Intel's 20A process node in the first half of 2024. By moving power lines to the backside of the wafer, PowerVia solves the growing interconnect bottleneck in die scaling.

Ben Sell said, "Intel is actively advancing the 'four-year five-process node' plan, and is committed to integrating one trillion transistors in a single package by 2030. PowerVia is very important to these two goals. Both are important milestones. By adopting experimental production process nodes and their test chips, Intel reduces the risk of using backside power for advanced process nodes and brings backside power technology to the market."

It is reported that Intel separates the research and development of PowerVia technology and transistors to ensure that PowerVia can be properly used in the production of Intel 20A and Intel 18A process chips. Before integrating with the RibbonFET transistors that will also be introduced with Intel's 20A process node, PowerVia is tested on its internal test node to continuously debug and ensure that it functions well. Intel said that after adopting and testing PowerVia on the test chip, it has been confirmed that this technology can indeed significantly improve the efficiency of the chip, with a cell utilization rate of more than 90%, and help to achieve a large scale of transistors, so that chip design companies can Improve product performance and energy efficiency.

According to Korean media Aju News, Samsung plans to reduce at least 10% of the wafer production at the S3 plant in South Korea’s Hwaseong Park starting from the third quarter of 2023.

Samsung Semiconductor will start reducing production at the S3 plant in Hwaseong Park in the third quarter. The S3 factory is a 12-inch production line built and put into operation by Samsung Semiconductor in 2018. It currently mainly produces 10nm to 7nm products. It is also one of the main production plants of Samsung Semiconductor's EUV advanced process. Samsung has deployed multiple ASML NXE3400 EUV lithography machines for it. .

Aju News pointed out that this production cut is the first time in recent years that Samsung has artificially reduced the amount of wafers put into semiconductor factories.

During the downturn in the semiconductor industry, in order to invest counter-cyclically to squeeze competitors such as TSMC, Samsung was still seeking to expand production until the beginning of this year. It plans to increase wafer production capacity by at least 10% by the second half of 2023, but the decline in the semiconductor industry is far faster than Samsung. expected.

The amount of Samsung Semiconductor's products in stock is nearly 32 trillion won, a record high since records were kept. Therefore, after reducing memory production and raising prices, Samsung had to further reduce the amount of system LSI wafers to balance inventory.

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Recently, Europe has established a gallium nitride scientific research project of up to 60 million euros, aiming to establish a complete supply capacity from power chips to modules.

In addition to Infineon, another 45 of its partners are involved. There is no doubt that this large-scale and high-investment GaN project highlights Infineon's determination to increase the layout for three and a half generations. To some extent, this will also be an important step for Europe to increase its chip manufacturing share and create a resilient supply chain.

In February last year, Infineon announced that it would spend more than 2 billion euros to build a third plant in Kulim, Malaysia, to produce SiC and GaN power semiconductors. At the same time, it said that in the future, the Si production line at the Villach plant in Austria will be transformed and converted to SiC and GaN production capacity.

Earlier, #Infineon announced that it had signed a final agreement with GaN Systems to acquire the latter for $830 million. The slightly aggressive expansion and the continuous advancement of the GaN technology roadmap all prove that Infineon is coveting this "cake".

In the ranking of the world's top ten power semiconductor manufacturers in 2021, Infineon ranked first with its absolute revenue advantage, followed by ON Semiconductor, STMicroelectronics, #Mitsubishi Electric, #Fuji Electric, Toshiba, Vishay, and #Anshi Semiconductors, Renesas Electronics, and Rohm. Almost every company here is accelerating the deployment of GaN.

From the perspective of the application of the third-generation half-power devices, consumer product power supplies, industrial and commercial power supplies, and new energy vehicles are the main markets. Especially as the penetration rate of new energy vehicles continues to increase, the requirements for energy saving and charging efficiency are getting higher and higher, and the potential of three and a half generations is becoming more and more prominent.

GaN power devices are mainly used in fields such as on-board chargers and DC-DC converters. Compared with Si, GaN can increase the charging speed by at least three times; compared with SiC, it also has advantages in high temperature resistance, high frequency resistance and high voltage resistance.

However, currently limited by the wafer preparation process and cost factors, the output of GaN is far less than that of SiC, and the application speed is slightly behind.

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On May 30th, Apple's spending on European suppliers has shown a continuous growth trend in recent years. It is reported that since 2018, Apple's spending on European suppliers has increased by more than 50%, totaling more than 85 billion euros. In 2022 alone, Apple will spend more than 20 billion euros in Europe.

Apple works closely with more than 4,000 European suppliers who provide innovative components and technologies for the manufacture of Apple products. Innovations from these European suppliers can be found in every Apple product, from sensors for the Apple Watch, to lidar for the iPhone, and microcontrollers for the Mac.

"The innovative spirit and incredible talent that brought Apple here in Europe more than 40 years ago has contributed more to our products than ever before," Cathy Kearney, Apple's vice president of operations, said in a release. So strong now. Our deep partnerships with European suppliers help us create breakthrough technologies, and we are proud to work closely with suppliers across Europe to advance our mission to decarbonize our entire global supply chain. "

Apple's suppliers in Europe include large multinational companies and small family businesses, some of which have been working with Apple for more than 30 years, and new companies join Apple's supply chain every year.

STMicroelectronics is a semiconductor maker based in France and Italy that focuses on developing and producing performance- and efficiency-optimized chips for Apple devices. The company has been working with Apple teams for years to develop integrated circuits for sensors, power management and wireless for the iPhone and other Apple products. STMicroelectronics has more than 27,000 employees in Europe and plans to invest more than 3.5 billion euros in 2023 to increase its global manufacturing capacity to produce components for Apple devices. The expansion will meet Apple's growing demand for microcontrollers as well as wireless, analog and mixed-signal integrated circuits.

Since 2020, Apple has been committed to carbon neutrality in its global business operations, and plans to achieve carbon neutrality in its entire global supply chain and the life cycle of each product by 2030. To achieve this goal, Apple works with suppliers to drive innovation, protect the planet and advance climate action. Among them, European manufacturing partners such as STMicroelectronics have made important progress in renewable energy.

In addition, companies such as DSM Engineered Materials in the Netherlands, Infineon in Germany and Austria, and Solvay in Belgium are supporting a range of renewable energy solutions such as wind projects, on-site solar and virtual power purchases Protocols and other innovative structures.

In conclusion, Apple's investment in European suppliers continues to grow, and cooperation with European suppliers has helped Apple create breakthrough technologies and advance its global supply chain decarbonization goals. This partnership not only strengthens the innovation capabilities of Apple products, but also promotes the adoption of renewable energy, making a positive contribution to sustainable development.

Hey guys, welcome to this blog. Today is another comparison article on electronic components, we will focus on NE5532 and its similar components: OPA2134, TL072 and NE5534. So off we go!

NE5532 vs OPA2134

The NE5532 is a Bipolar Input op-amp and the OPA2134 is a Fet Input op-amp.

Although many people claim NE5532 as an old component and try to find a new one to take its place, the NE5532 is still good enough for most applications. Plenty of new audio equipment still uses old op-amps such as the NE5532 and TL072 because anything better is overkill and not cost-effective.

If you can use a bipolar OP, the NE5532 is usually the better choice than a JFET OPA2132 / OPA2134. The OPA2134 is more a better replacement for the TL072 when you need a FET type. This may be the case with low-frequency filters.

Hey guys, if you are an electronic DIY lover, you will always find a lot of similar or interchangeable components, which have subtle differences in the specs or features, therefore lead to the wrong application, 74HC595 and its similar components is an example I'm going to mention today.

74HC595 and 74HC164, 74LS595 and MCP23017, except for the last one, the former three ICs are shift registers that can drive LEDs, especially 74HC595, it can drive LEDs directly, those components are alike in some way and have their own distinguishing features as well.

So let's explore these four ICs specifications and compare them to see what are their differences.

74HC595 VS 74LS595


74LS595 is TTL based, fast, uses more power and is older.
74HC595 is CMOS based, fast, uses less power and is the most up-to-date version.